Contactless Resistivity/Thickness, Sheet Resistance 100mm - 300mm Silicon
	Download the full .pdf version of the RS300 brochure here. Read TriQuint Semiconductor testimonial regarding over $250K per year savings using LEI equipment. Throughput: -55 measurement sites in 2.5 minutes -User-definable test plans (up to 300  meas. sites)
Features: -Non-destructive characterization of 100mm to 300mm Si wafers -GEM/SECSII compliance -LEI Windows NT Software (standard) -HERMOS available -Bar-code scanning availability -Scanning end effector	Facility Requirements: -Voltage 100-120 VAC ± 50-60 Hz 220-240 VAC ± 50-60 Hz -Vacuum 400-600 mm Hg
Performance: *(Conforms to ASTM F673) Based on average of a repeat 10 center-point test of a NIST-traceable, uniformly doped silicon standard (where available). NIST wafers available for calibration.

 

Footprint:
 

Thickness:
-Range
 300-1000 um*
-Repeatability
 Resolution to 0.1 um

*extended thickness range from 1000-2000 um available upon request