Model 1510E-RP

Measurement and Mapping Systems
Contactless Bulk Resistivity/Sheet Resistance/Capacitance Thickness

Characterization of:

All compound semiconductor materials
(epi, annealed ion-implants on semi insulating and some doped substrates)

Silicon wafers
(bulk Si, epi, annealed ion-implants, and POCl3 doping uniformity on high resistivity substrates)

Thin film metallization
(Contact factory for details)

Measurement Capabilities

Sample thickness range of 450 to 800 microns
Normal coil gap (>/= .035”/.889mm)
Robotic handling of 2” (50mm) to 8” (200mm) wafers