Model 1510E-RP

Measurement and Mapping Systems Contactless Bulk Resistivity/Sheet Resistance/Capacitance Thickness

  • Characterization of all compound semiconductor materials
    • EPI, Annealed Ion-Implants on Semi-insulating and some doped substrates
  • Silicon wafers
    • bulk Si, EPI, annealed ion-implants, and POCl3 doping uniformity on high resistivity substrates
  • Thin film metallization
    • Contact factory for details
  • Measurement Capabilities
    • Sample thickness range of 450 to 800 microns
    • Normal coil gap (>/= .035”/.889mm)
    • Robotic handling of 2” (50mm) to 8” (200mm) wafers
  • TAGS